Suzhou SIP Weil Semiconductor Tooling
“Semiconductor packaging molds”
Company Profile
Semiconductor packaging and leadframe mold maker serving power device and IC assemblers.
Products
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Capabilities
- 🏅 Cert.
- ISO 9001,ISO 14001
- 🌍 Export
- Worldwide, Europe, North America, Southeast Asia
- ⚙️ Process
- precision tooling, rapid prototyping
- 🎯 Client
- manufacturing & industrial clients
- 📍 Location
- 中山，中国
- 🏷️ Type
- 模具